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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 27 Jul 2004 09:24:49 -0500 |
Content-Type: | text/plain |
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Rich,
According to Table 6-1, column A7 in IPC-2221 (Appendix A, Table 6-1 in
IPC-A-610C), the solder deposit cannot reduce the minimum electrical spacing
below 0.13mm, for voltage potentials of 0-100V (AC/DC peak) between
non-common conductors, for operation at any elevation, if the assembly is to
be conformally coated.
For Class 3, the solder deposit / ball must also be attached / fused to a
metal surface, fully encapsulated by the coating, and shall not be capable
of being dislodged during exposure / use in normal service environment.
Bob
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Tuesday, July 27, 2004 8:37 AM
To: [log in to unmask]
Subject: [TN] Allowable solder balls on a component?
What is the largest solder ball I am allowed that would not violate
minimum electrical clearance?
I am working within class 3 requirements. The component in question has
9.6mm spacing from the edge of one pad to another. Eventually this
assembly will be conformally coated.
I've turned to A-610, section 12.4.10 but it presents me with this
"minimum electrical clearance" question, and it's appendix 1 doesn't
seem to be of much help.
Any thoughts would be truly appreciated.
Rich K
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