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July 2004

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Subject:
From:
"COOKE, ROBERT W. (JSC-NX) (WGI)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Jul 2004 09:24:49 -0500
Content-Type:
text/plain
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text/plain (64 lines)
Rich,

According to Table 6-1, column A7 in IPC-2221 (Appendix A, Table 6-1 in
IPC-A-610C), the solder deposit cannot reduce the minimum electrical spacing
below 0.13mm, for voltage potentials of 0-100V (AC/DC peak) between
non-common conductors, for operation at any elevation, if the assembly is to
be conformally coated.

For Class 3, the solder deposit / ball must also be attached / fused to a
metal surface, fully encapsulated by the coating, and shall not be capable
of being dislodged during exposure / use in normal service environment.

Bob

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Tuesday, July 27, 2004 8:37 AM
To: [log in to unmask]
Subject: [TN] Allowable solder balls on a component?

What is the largest solder ball I am allowed that would not violate
minimum electrical clearance?

I am working within class 3 requirements.  The component in question has
9.6mm spacing from the edge of one pad to another. Eventually this
assembly will be conformally coated.

I've turned to A-610, section 12.4.10 but it presents me with this
"minimum electrical clearance" question, and it's appendix 1 doesn't
seem to be of much help.

Any thoughts would be truly appreciated.


Rich K





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