Remove them - they will effect the drill wear and the lam bond.  A resin
to resin bond is the strongest (drill interface to a land is the
weakest) and non-functional should be removed.  On thicker PCB's, it is
GMP to have non-functional inner board thieving to support good resin
flow, package stability and eliminate low pressure areas.  Most CAM
automations support a good logic for inner board thief.  



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Ofer Cohen [mailto:[log in to unmask]] 
Sent: Tuesday, July 27, 2004 6:48 AM
To: [log in to unmask]
Subject: [TN] Removal of non functional pads


Technetters,
Are there any guidelines regarding removal of non functional pads in
thick (>2.5 mm) PCBs? Are the guidelines documented somewhere?

Regards
Ofer Cohen
Manager
Quality Assurance, Reliability and Production Technologies

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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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