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Subject:	Re: Removal of non functional pads
From:	Brian Ellis <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 27 Jul 2004 13:36:58 +0300
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

I presume you mean on inner layers. Keep them there. If you delete them,
   you have to have resin to take their place. This leads to a
mechanically weaker spot, just where you apply stress by drilling. You
therefore have a greater risk of local delamination and the entry of
plating liquids where you don't want them. By keeping them there, your
assembly is tighter.

Not a guideline but common sense!

Brian

Ofer Cohen wrote:

> Technetters,
> Are there any guidelines regarding removal of non functional pads in thick (>2.5 mm) PCBs? Are the guidelines documented somewhere?
>
> Regards
> Ofer Cohen
> Manager
> Quality Assurance, Reliability and Production Technologies
>
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