Here is a fabrication note I worked up with the fab shop.

"All vias drilled equal to or less than .0xx shall be plated, then
filled with non conductive material, such as Peter's paste # SD-2361,
or equivalent. Surface to be planar prior to final plating and
metallization.
Boards must be suitable for via in pad technology."

http://www.peters.de/

I would recommend working with your fabricators to find the best solution
to your requirement.

Hope this helps,

Dave




Michael Bonek wrote:

>We want to fill our via's in smd land with conductive material so the land
>will be flat and no PPT will fall into the hole. I cannot find an IPC
>specification that calls out a conductive via fill for a drill drawing
>note. I know not to be too specific on the type of material to be used and
>that I do want it planerized and followed with subsequent plating finish.
>Is anybody aware of an IPC drill drawing specification or would like to
>share how they specify this process on there drill drawing?
>
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--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

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