We want to fill our via's in smd land with conductive material so the land
will be flat and no PPT will fall into the hole. I cannot find an IPC
specification that calls out a conductive via fill for a drill drawing
note. I know not to be too specific on the type of material to be used and
that I do want it planerized and followed with subsequent plating finish.
Is anybody aware of an IPC drill drawing specification or would like to
share how they specify this process on there drill drawing?

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