Dave,

 

The recommendation you received is incorrect. Read IPC-7095 and
IPC-SM-782 for an understanding of the joint reliability
characteristics. 

 

Dieter Bergman

 

________________________________

From: TechNet on behalf of Dave Seymour
Sent: Fri 7/23/2004 9:16 AM
To: [log in to unmask]
Subject: [TN] BGA Land Patterns

To All,

I just had an assy house recommend a diamond shape
or tear drop shape for a BGA land pattern to allow for better
optical inspection related to reflow and solder opens detection.

Has anyone come across a white paper or reliability study
for or against alternative pad shapes for BGAs?

dave

--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

[log in to unmask]

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