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July 2004

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Subject:
From:
"Morse, Carrie" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 23 Jul 2004 11:54:31 -0400
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text/plain (104 lines)
I think that was a typo -- it's page 18.
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Friday, July 23, 2004 11:09 AM
To: [log in to unmask]
Subject: Re: [TN] Pin Size vs. Plated Through Hole Size

Ramon,

   I too was searching for such a guideline.   However, my IPC 2222 date
February 1998 only has 23 pages of text not 28.    What rev are you
quoting.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Friday, July 23, 2004 9:33 AM
To: [log in to unmask]
Subject: Re: [TN] Pin Size vs. Plated Through Hole Size


                Hi Helena:
                                You might already have this info, but
anyway. Page 28 of IPC 2222 may have what you want. Board manufacturer
know this as well.
              Regards,
                Ramon


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Pasquito, Helena
Sent: Monday, July 12, 2004 12:39 PM
To: [log in to unmask]
Subject: [TN] Pin Size vs. Plated Through Hole Size


I am looking for a specification that would have information on 'pin
size' vs. 'plated through hole size' design
requirements/recommendations/limits
for wave soldering applications.  Does anyone know of any such
specification (internal or external)?

Thank you for any help you can offer.

Helena Pasquito
Quality Training Admin./CRM
Tyco Electronics M/A-COM
1011 Pawtucket Blvd. M/S150
Lowell, MA 01853
Phone 978-442-5024
Email [log in to unmask]

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