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July 2004

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Subject:
Re: Suggestions for removing solder balls from wave
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 21 Jul 2004 10:49:16 -0500
Content-Type:
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text/plain (38 lines) 
I had a problem similar with resistor packs.  We fluxed the area and then using hot air and wick we put the wick next to the end of the resistor pack and the solder ran to the wick.  You could probably use an iron too. We found for some the more difficult ones you could tip the board down a little and gravity helped out to.  

Kat


>>> [log in to unmask] 07/21/04 09:36AM >>>
One of our facilities ran a large job of boards with what I think was a
combination of too much flux and too little preheat at the wave. (The flux
is water based.) The result was many solder balls lodged underneath
backside SOICs.

Does anyone have any suggestions on the best way to try to get these off
of the board? The standard aqueous clean obviously didn't work. We are
experimenting now with compressed air, ultrasonic clean, and maybe a
saponified clean.

Thanks, Cheryl

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