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July 2004

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Subject:
Re: Reflowing leadfree CSP
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Jul 2004 16:23:15 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (63 lines) 
Pb-free balls will always "collapse" once in contact with a Pb-Sn alloy.

Vladimir

Vladimir Igoshev, 
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2

Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]


-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Tuesday, July 20, 2004 3:36 PM
To: [log in to unmask]
Subject: Re: [TN] Reflowing leadfree CSP


We tried this and were not able to treat the ball as though it were "high
temp". The Pb-Free balls collapsed, even with reflow temperature at around
210, and looked like a jiffy-pop popcorn bag. We did not attempt to qual the
results.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter L
> Sent: Tuesday, July 20, 2004 3:03 PM
> To: [log in to unmask]
> Subject: [TN] Reflowing leadfree CSP
>
> Technet,
>
> Is there any process/ reliability concern with reflowing a
> 0.5mm pitch CSP with lead free solder bumps using a tin/lead
> solder paste process? Assuming that the reflow profile will
> not cause any melting/collapsing of the lead free solder bumps.
>
>
> Rgds,
> Peter

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