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July 2004

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Subject:
Reflowing leadfree CSP
From:
Peter L <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Jul 2004 14:02:34 -0500
Content-Type:
text/plain
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text/plain (21 lines) 
Technet,

Is there any process/ reliability concern with reflowing a 0.5mm pitch CSP
with lead free solder bumps using a tin/lead solder paste process? Assuming
that the reflow profile will not cause any melting/collapsing of the lead
free solder bumps.


Rgds,
Peter

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