Wow, this is fantastic! Will you adopt me? Earl needs to get this in his
next book. We went to seminars and meetings and have read paper after paper.
I have been putting together a project scope for two months and have the
individual pieces identified but never in one place. Thank you Mike.
Dave Chapman
CSI
-----Original Message-----
From: Barmuta, Mike [mailto:[log in to unmask]]
Sent: Thursday, July 01, 2004 5:38 PM
To: [log in to unmask]
Subject: Re: [TN] Leadfree transition plan
Ken: I am heading up our team at Fluke to identify potential issues for the
change over to lead free solder. I think you'll find it's quite
comprehensive. I hope it's useful to you and the other TechNet users.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
LEAD FREE TRANSITION FLUKE CORP.
BARE BOARD ISSUES:
· Laminate: Temperature rating 170+C, identify and convert lower Tg
materials
· CTE: Z axis expansion, via and PTH reliability, thru hole copper plating
thickness, delamination.
· Final finishes: Gold, Tin, Copper, Immersion coatings, OSP with higher
temperatures and multiple heat cycles, convert existing HASL products
· Panelization: Identify board routing and support that are insufficient
with higher temperatures, reflow and wavesolder
· Identify Suppliers with required capabilities
· Evaluate and Select Suppliers
· Evaluate finish solderability
· Identify/mark lead free boards
· Inventory control/segregation Lead/Lead Free
· Document changes
· Develop timeline for implementation of required changes
COMPONENT ISSUES:
· Material of construction: Temperature rating 260C peak/220C ninety
seconds, identify and convert lower temperature rated materials, what to do
with components that can not be converted
· Final finishes: Gold, Tin matte/bright/low stress/reflowed, Nickel,
Palladium, Alloys, identify and convert lead finishes, what to do with
components that can not be converted
· Identify Suppliers with required capabilities
· Evaluate and Select Suppliers
· Evaluate component performance
· Evaluate finish solderability
· Identify/mark lead free components
· Inventory control/segregation Lead/Lead Free
· Document changes
· Develop timeline for implementation of required changes
SURFACE MOUNT ISSUES:
· Lead Free Solder Paste: Select alloy, select flux , select vendors,
develop test matrix
· Stencil Print: Evaluate; printability, working life, placement life, print
speed, separation, stencil clean: printer, stencil and board, determine
required changes, incorporate changes
· Stencil Clean: printer, stencil and board, determine required changes,
incorporate changes
· GPD Dispensing: Evaluate; dispensability, program settings, determine
required changes, incorporate changes
· Reflow: Characterize zone settings for paste, board types, board finishes
and component types. Rates, ramps, dwell times, min/max temperatures,
cooling. Higher temperatures affecting board warpage, fixturing, component
compatibility. Determine optimum recipes, incorporate changes.
· Solderability: Wetting, solder joint appearance and acceptability.
Increased voiding and defects
· AOI: Determine inspectability of solder joints, appearance of solder
joints, determine required changes, incorporate changes
· Equipment Effected: Reflow: Higher temperatures, transport system,
fixturing, ventilation, maintenance, upgrades, vapor phase, nitrogen.
Stencils: apertures
· Moisture Sensitive Components: Shorter exposure times ratings, baking
· Inventory control/segregation Lead/Lead Free
· Waste and Reclaim
· Document changes
· Develop timeline for evaluation, testing, and implementation of required
changes
HAND SOLDER ISSUES:
· Lead Free Core Solder: Select alloy, select flux , select core and
diameter, select auxiliary flux, select vendors, develop test matrix
· Solder Iron: Type, temperature, tip, dwell times, techniques,
· Solderability: Wetting, solder joint appearance and acceptability
· Safety: Ventilation
· Cleaning: Determine bench top cleaning chemistry
· Inventory control/segregation Lead/Lead Free
· Document changes
· Develop timeline for evaluation, testing, and implementation of required
changes
REWORK/TOUCH UP ISSUES:
· Lead Free Core Solder: Select alloy, select flux , select core and
diameter, select auxiliary flux, select vendors, develop test matrix
· Equipment: Rework stations, BGA
· Solder Iron: Type, temperature, tip, dwell times, techniques,
· Solderability: Wetting, solder joint appearance and acceptability
· Safety: Ventilation
· Cleaning: Determine bench top cleaning chemistry
· Inventory control/segregation Lead/Lead Free
· Document changes
· Develop timeline for evaluation, testing, and implementation of required
changes
WAVESOLDER ISSUES:
· Solder: Select alloy, select vendors, develop test matrix, ability to
maintain correct alloy composition for liquidous and wetting properties
· Flux: Select flux, select vendors, develop test matrix
· Develop Recipes: Individual settings for: flux, conveyor speed, preheats,
chip wave, Lambda wave
· Solder Pot: Temperature, flow settings, dross control
· Higher Temperatures: Affecting board warpage, fixturing, support,
component compatibility.
· Equipment Effected: Higher temperatures, additional preheat, ventilation,
maintenance, upgrades, nitrogen, solderpot degradation, new machine
· Solderability: Wetting, solder joint appearance and acceptability. Higher
defects.
· Inventory control/segregation Lead/Lead Free
· Waste and Reclaim
· Document changes
· Develop timeline for evaluation, testing, and implementation of required
changes
CLEANING ISSUES:
· Water Wash: Determine impact of new fluxes on assembly cleaning, machine
settings, saponifier conc., wash water temperature, rinse water temperature,
conveyor speed, hold times
· Corpane Wash: Determine impact of new fluxes on assembly cleaning ,
machine settings, wash water temperature, rinse water temperature, conveyor
speed, hold times
· Ionic Extraction Testing
· Surface Insulation Resistance (SIR)Testing
· Board Appearance/Condition: Reaction to higher process temperatures,
fluxes
· Document changes
· Develop timeline for evaluation, testing, and implementation of required
changes
ELECTRICAL TESTING ISSUES:
· Flux Residues: Interfering with electrical pin contact
· Board Warpage
· Document changes
· Develop timeline for evaluation, testing, and implementation of required
changes
FIELD AND SERVICE REPAIR ISSUES:
· Lead Free Core Solder: Select alloy, select flux , select core and
diameter, select auxiliary flux, select vendors, develop test matrix
· Equipment: Rework stations, BGA
· Solder Iron: Type, temperature, tip, dwell times, techniques,
· Solderability: Wetting, solder joint appearance and acceptability
· Safety: Ventilation
· Cleaning: Determine bench top cleaning chemistry
· Inventory control/segregation Lead/Lead Free
· Waste and reclaim
· Document changes
· Develop timeline for evaluation, testing, and implementation of required
changes
PRODUCT, PROCESS and MATERIAL QUALIFICATION:
· Determine which products/product families require testing
· Determine Test Matrix: Board Material, Board Finish, Component Finish,
Component Material, Solderpaste, Solder, Flux, Auxiliary Flux, Cleaning Type
· Electrical Testing: Humidity, High Pot, Electromigration, SIR
· Solder Joint Reliability: Thermal Cycle, Thermal Shock, Bend, Impact,
Drop, Vibration, Large Mass Components
· Develop timeline for evaluation, testing, and implementation of required
changes
COSTS WILL BE ASSOCIATED FOR THE FOLLOWING:
· Materials: Solder Bar and Roll, Solderpaste, Flux, Existing Inventory
· PCB's: Higher Tg laminate, Final Finish Lead Free Coatings, Possible
Re-Panelization, Existing Inventory
· Components: Higher Heat Resistant Materials of Construction, Lead Free
Solderable Finishes, Existing Inventory
· Equipment: Wavesolder, Reflow Ovens, Rework Stations, Fixturing, HVAC,
Maintenance, Inert Gas
· Associate Time: Materials Identification and Selection, Process
Development, Material and Process Testing, Documentation, Implementation,
Materials and Process Monitoring and Correction
· Product Reliability: Defect Rate, Long Term Solder Joint Strength,
Component Integrity, Product Electrical Performance
· Lead Free Certification of Products
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ken Patel
Sent: Wednesday, June 30, 2004 11:02 AM
To: [log in to unmask]
Subject: [TN] Leadfree transition plan
Guys,
I have been given a task of implementing Leadfree change over. We are OEM
and our CM to build assemblies for us. Part of my responsibility is to come
out with a clear plan for transition from Pb containing to leadfree
assemblies. Does anyone has created such plan and willing to share with me.
This plan of attack will help us in moving smoothly to leadfree with fewer
headaches. I know I have to work with not only CM but also with suppliers.
Any help will be highly appreciated.
Re,
Ken Patel
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