At our company, we use approximately 9 mil spacing edge to edge of via pad
and we also started encroaching the soldermask slightly over
the via pad by a couple of mils (in place of tenting the hole
with soldermask which can cause problems).  The soldermask
encroached vias work very well for us to help avoid bridging problems.
For example, on a 25 mil via with an 11 mil finished hole, the soldermask
opening would be 20 mils.

Kaye


At 04:22 PM 07/13/2004, you wrote:
>Good day T-Net
>
>We are experiencing some bridging problems between via's on a customers
>boards. I am wondering what the recommended minimum spacing between
>non-common via's should be.
>
>
>Barry.
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 1.8e
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
>Search the archives of previous posts at: http://listserv.ipc.org/archives
>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
>-----------------------------------------------------
>
>_____________________________________________________________________________
>Scanned by IBM Email Security Management Services powered by MessageLabs. For more information please visit http://www.ers.ibm.com
>_____________________________________________________________________________
















CONFIDENTIALITY NOTE: This message is intended only for the use of the individual or entity to which it is addressed and may contain information that is privileged, confidential, and exempt from disclosure under applicable law. If the reader of this notice is not the intended recipient, you are hereby notified that any dissemination, distribution or copying of this communication is strictly prohibited. If you have received this communication in error, please notify the sender immediately.


_____________________________________________________________________________
Scanned by IBM Email Security Management Services powered by MessageLabs. For more information please visit http://www.ers.ibm.com
_____________________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------