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July 2004

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Subject:
From:
Ofer Cohen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Jul 2004 08:20:03 +0200
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To make a robust and portable design do not allow less than 5 mils between unconnected vias, no limit for equipotential vias. You should consider also the thermal characteristics of the neighbours, which becomes more important as the components become smaller.

Regards
Ofer Cohen
Manager
Quality Assurance, Reliability and Production Technologies
Seabridge Ltd. - A Siemens Company

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Barry Gallegos
Sent: Tuesday, July 13, 2004 22:23
To: [log in to unmask]
Subject: [TN] Via Spacing


Good day T-Net

We are experiencing some bridging problems between via's on a customers
boards. I am wondering what the recommended minimum spacing between
non-common via's should be.


Barry.

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