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July 2004

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Subject:
From:
Franklin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Jul 2004 15:52:34 -0500
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I would think that depends upon the end use of the board, real estate,
number of layers, complexity, type of components being placed, etc etc
etc...

Now that was a simple answer...yes...

Seriously, it depends upon what is expected of the board, and to some extent
the process capabilities of your fabricator(s).

We can typically etch 1/2 ounce copper to 2 mil spacing... we do however, on
a rare occasion (grin) get shorts between vias...but with care and proper
process controls, etc etc I think even 1 mil or less is attainable...

Work with your supplier...find out if they belive they can meet that and
develop a solution together...and have fun with it...

Franklin

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