Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 13 Jul 2004 15:52:34 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
I would think that depends upon the end use of the board, real estate,
number of layers, complexity, type of components being placed, etc etc
etc...
Now that was a simple answer...yes...
Seriously, it depends upon what is expected of the board, and to some extent
the process capabilities of your fabricator(s).
We can typically etch 1/2 ounce copper to 2 mil spacing... we do however, on
a rare occasion (grin) get shorts between vias...but with care and proper
process controls, etc etc I think even 1 mil or less is attainable...
Work with your supplier...find out if they belive they can meet that and
develop a solution together...and have fun with it...
Franklin
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|