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July 2004

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Subject:
From:
"McCullen, Jack T" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 22 Jul 2004 14:34:45 -0700
Content-Type:
text/plain
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text/plain (142 lines)
Greg,

No, The thickness should not include the solder ball.

Regards,
Jack
 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Greg Kowal
Sent: Thursday, July 22, 2004 2:30 PM
To: [log in to unmask]
Subject: Re: [LF] Question on maximum reflow temperature in Jedec
Standard - J-STD-020B

Jack,

Thank you for your response last week.  I have seen the Jedec.org site
now has the J-STD-020C standard available.  One question I have on the
thickness, does the thickness include the solder ball?  I assume it
does but I am looking for clarification.

Thanks,

Greg

 -----Original Message-----
From:   McCullen, Jack T [mailto:[log in to unmask]]
Sent:   Wednesday, July 14, 2004 11:06 AM
To:     (Leadfree Electronics Assembly Forum); Greg Kowal
Subject:        RE: [LF] Question on maximum reflow temperature in Jedec
Standard -         J-STD-020B

Greg,
J-STD-020C uses a table to indicate the maximum reflow temperature.
The table is based on package volume and package thickness.  The
standard is approved and is in the publication process and will be
available shortly.
Regards,
Jack McCullen

Package
Thickness                       (Volume mm3 < 350)      (Volume mm3 350
- 2000)     (Volume mm3 > 2000)
< 1.6 mm                                260
260                             260
1.6 mm - 2.5 mm                 260                             250
245
2.5 mm                                250
245                                     245
* Tolerance: The device manufacturer/supplier shall assure process
compatibility up to and including the stated classification temperature
(this means Peak reflow temperature +0 C. For example 260 C +0C) at the
rated MSL level.


-----Original Message-----
From:   Leadfree [mailto:[log in to unmask]] On Behalf Of Greg Kowal
Sent:   Wednesday, July 14, 2004 10:31 AM
To:     [log in to unmask]
Subject:        [LF] Question on maximum reflow temperature in Jedec
Standard
-
        J-STD-020B

Hello all,
The current standard has for pb-free large body a maximum reflow of
245C.  I believe there was some discussion this would be revised to be
a maximum reflow temperature of 260C.  Can anyone verify if this is
really the case and if so, when should we expect the revision to occur?
Regards,
Greg Kowal
p.s. I have been a "lurker" here for a while and have learned a lot.
Thank you to everyone who contributes.


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=====
Greg Kowal
Vancouver, BC



______________________________________________________________________
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