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July 2004

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Subject:
Re: Reflowing lead free CSP
From:
Jose Antonio Garcia Ontalba <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 21 Jul 2004 08:49:01 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (58 lines) 
Hallo Peter,

I have found a Calce's technical paper with information about long-term
reliability of lead-free soldered  products. In this paper, the 0.5 mm pitch
component finishes' reliability were successfully proved. Here you have the
link:

http://www.calce.umd.edu/whats_new/2004/long-term.pdf

Regards

Jose

-----Mensaje original-----
De: Leadfree [mailto:[log in to unmask]]En nombre de Peter L
Enviado el: martes, 20 de julio de 2004 20:41
Para: [log in to unmask]
Asunto: [LF] Reflowing lead free CSP


Is there any process/ reliability concern with reflowing a 0.5mm pitch CSP
with lead free solder bumps using a tin/lead solder paste process? Assuming
that the reflow profile will not cause any melting/collapsing of the lead
free solder bumps.


Rgds,
Peter

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