We are starting the trek down lead-free lane, and I just found out that my trusty IPC land patterns are (supposedly) not going to work with lead-free solder.  Our (vendor's) process includes using Kester 908HPS or Alpha OM-338 solder with Enthone-OMI OSP-CU-106 as the board finish.

What is your experience regarding the change-over?  Do land patterns need to be revised to work with lead-free solder process(es)?

TIA

Roger

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