LEADFREE Archives

July 2004

Leadfree@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 20 Jul 2004 13:40:44 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines)
Is there any process/ reliability concern with reflowing a 0.5mm pitch CSP
with lead free solder bumps using a tin/lead solder paste process? Assuming
that the reflow profile will not cause any melting/collapsing of the lead
free solder bumps.


Rgds,
Peter

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------

ATOM RSS1 RSS2