Hi Intel-Jack, TI-DougR,Abbott , , IPC LF Listservers,

Jack, the chart came out aligned and readable both on the IPC list and in
the email when I moved it to Notepad.

It seems like this is going to change at least two tables in the standard,
that is: Table 4.1 and 5.2 ??

Any other significant changes like the profile, the ramp down, etc.


If you or one of the other component people have the chance to post, what
was the reason for adding a third thinner category and keeping it's
temperature exposure higher???


My guess is that this was a practical matter in that when the thicker
packages get to soldering temperature the smaller packages on the same
electronic assembly will have to withstand higher temperatures. Of course
it could have also been a bit of politics to obtain concurrence.


Yours in Engineering, Dave
Y i Engr, MA/NY DDave

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