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July 2004

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Subject:
query
From:
"Gupta, Munish" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sat, 17 Jul 2004 11:28:08 +0530
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines) 
17  july  04


Very  goodmorning , 

Lets  start  the  open  house .......



Is  using  HOT  DIP  TIN  for  lead  finish  of  bigger  packages ( TO 92 , TO220 , TO 126  BJT + Mosfets) a  known  strategy  for  reducing  whiskers ! ! ! 


If  yes , can  POST  BAKE  ( 150 C , 1 hr)  be  evaded ?


Pls  confirm/advice


thanks  beforehand

munish

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