14 july 04
hello again,
Any other mitigation strategy considerd by component manufacturers .....
Pls share.
My understanding is :
1.. HOT DIP inhibits whisker growth , no need for whisker test . . should be applicable for big packages like TO220 , TO126 (sorry SOT32), TO 92 and not for Surface mount packages i.e SOT223 , SOT23 etc
2.. Whisker suppression to be done for MATTE TIN plating on the leads.
Pls correct me if i am faltering in my understanding
thanks again
kind regards
munish
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, July 14, 2004 5:03 PM
Subject: Re: [LF] Whisker test
> Dear Munish,
>
> The mitigation strategy of 1 h @ 150 degrees postbake is applicable for all
> Cu based leadframes. (I prefer the name postbake, since annealing is not
> the main strategy leading to this mitigation strategy).
> I agree with you that you will not expect such a long whiskers to grow in
> between the leads of this course pitch to cause shorts in this components.
> However, several end-users have expressed concerns that the whiskers grown
> on coarse pitch packages might break off and cause shorts in the fine pitch
> packages in their products. Therefore, they prefer a mitigation practice.
> A mitigation process will cost time and energy, but the proposed postbake
> limits this (using Pb would be more cost and energy effective but will be
> banned by the legislation)
>
>
> With kind regards,
>
> Pascal
> ------------------------------------------------------------------
> Dr. ir. P. Oberndorff
> Philips CFT, SAQp 233
> Process Technology/ Electronic Packaging & Thin Film
> P.O. Box 218
> 5600 MD Eindhoven
> Tel: +31 (0)40 27 32223
> fax: +31 (0)40 27 36815
> e-mail: [log in to unmask]
>
>
>
>
> To: [log in to unmask]
> cc: (bcc: Pascal Oberndorff/EHV/CFT/PHILIPS)
> Subject: [LF] Whisker test
>
> "Gupta, Munish" Classification:
> <[log in to unmask]>
>
> Sent by:
> Leadfree
> <[log in to unmask]>
>
> 2004-07-14 10:46 AM
> Please respond to
> "(Leadfree Electronics
> Assembly Forum)"; Please
> respond to "Gupta,
> Munish"
>
>
>
>
>
>
> 14 july 04
>
>
> Need expert inputs only...
>
>
> Is whisker mitigation strategy* applicable for all packages.
>
>
> A big package like TO220 where leads are seperated by a large
> distance (much greater than what a typical length of whisker is :
> 50um) should NOT undergo special tests like annealing.
>
> Annealing is time as well as energy consuming.
>
>
>
> *: bake for 150C @ 1hr
>
> advised by ST , Philips , Infenion
>
>
>
> Any comments TONY ! ! !
>
>
> regards
> munish
> INDIA
>
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