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July 2004

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Subject:
From:
"Gupta, Munish" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 7 Jul 2004 13:09:13 +0530
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines)
07 july 04


hello  again,


A)
No  tin  whisker  test  is  required  for  the  following  finishes :

  1.. NiPdAu , NiPd
  2.. Fused Tin (dipping) with  or  without  Nickel  underplate
  3.. Noble  metal  plating  except  Ag

B)
Finish  which  requires  Tin  whisker  Test :

  1.. Matte  Tin / high  tin  alloy  with  or  without  Nickel  underplate

Need  to  know  what  is  the  difference  between  A2  and  B1.

Is  it  that  A2  is  HOT  DIP  and  B1  is  Electroplating .. . . . .  


Comments  awaited.............



regards
munish




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