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July 2004

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Subject:
From:
Joe Layug <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 26 Jul 2004 19:32:54 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (114 lines)
Hi John,

Thanks for quick reply.  Question now is, why do
companies choose 30 microinches thickness and not 15
microinches or 10 microinches.  Does anyone have a
paper on this one?

Regards,
Joe

--- John Burke <[log in to unmask]> wrote:
> Selective electroplated gold is used as a method to
> avoid black pad which
> can be an issue with ENIG. The effect in the BGA
> areas that arises sometimes
> with enig which is typically called black pad is
> actually associated with
> other failure mechanisms than classic black pad but
> either way, the
> electroplating avoids the issue.
>
> Kind regards,
>
> John Burke
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of
> Joe Layug
> Sent: Monday, July 26, 2004 7:19 PM
> To: [log in to unmask]
> Subject: Re: [LF] LeadFree and Land Patterns
>
>
> Hi,
>
> I have a question on electroplated gold finish for
> PCB.
>
> 1.) Why is it that some companies require 30
> microinches electroplated gold all over?
> 2.) Why is it that some companies require 30
> microinches selective hard gold especially in BGA
> areas?
>
> My understanding is that if the gold plating is too
> thick, this would result in poor solderability.  I
> thought before that the 30 microinches hard gold is
> usually used for edge connectors.  Wouldn't it be
> cheaper for companies to use ENIG instead for the
> solderable areas?
>
>
>
> __________________________________
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