I'm having a philisophical discussion with my boss regarding long reflow soak times to improve soldering under BGA devices.  Is there anything to be gained by extending soak times at the 150C level from 60-90 seconds to 5-10 minutes? I've never seen times this extended and am wondering if they make sense in some situations?  The boards in question are not terribly difficult, .063" thick, 14 layer, 12x16 inches with maybe a couple thousand components on top.  Any comments on this practice?

 

Thanks in advance,

 

Rick Thompson

 

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