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Tue, 27 Jul 2004 13:36:58 +0300 |
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I presume you mean on inner layers. Keep them there. If you delete them,
you have to have resin to take their place. This leads to a
mechanically weaker spot, just where you apply stress by drilling. You
therefore have a greater risk of local delamination and the entry of
plating liquids where you don't want them. By keeping them there, your
assembly is tighter.
Not a guideline but common sense!
Brian
Ofer Cohen wrote:
> Technetters,
> Are there any guidelines regarding removal of non functional pads in thick (>2.5 mm) PCBs? Are the guidelines documented somewhere?
>
> Regards
> Ofer Cohen
> Manager
> Quality Assurance, Reliability and Production Technologies
>
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