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June 2004

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Subject:
From:
Daan Terstegge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 7 Jun 2004 15:38:34 +0200
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Hi Blair,

Out of the many articles that I have read about this subject not a
single one clearly states that leaded parts in leadfree solder is a big
"NO".  The researchers seem to limit their conclusions to statements
like "combination A fails after 3000 cycles, combination B after 2930
cycles" or "combination A is stronger than combination B". I welcome all
papers that support other opinions, and I'm willing to add them to my
leadfree webpage for everyone's benefit.
To my opinion the issue of thermal detoriation of components that were
not designed for the higher leadfree soldering temperatures is a much
more viable concern.

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net



>>> [log in to unmask] 06/04/04 03:25pm >>>
I have no actual experience with this, however, from what I have
learned in following this list and the LeadFree list is that if you use
components with Pb (lead) based finishes on the leads in a lead-free
process, the reliability of the solder joints is questionable.

If you use lead-free finishes in a tin-lead soldering process effect is
minimal.

Others on this list can explain why, and you may be able to find that
information in a search of the archives.

Bottom line is if you are using a lead-free soldering process, it is
highly recommended that all components used are also lead-free. If you
still have a tin-lead process, you can mix.

Blair Hogg
QA Manager
GAI-Tronics Corp.

>>> [log in to unmask] 06/04/04 09:13AM >>>
Dear Experts,

      Is it possible to use some normal components (with lead) along
with
lead free components in the same PCBA. Since the tempertaure
requirement of
lead free components is higher will it affect the normal components? Or
is
it possible to assemble normal components first and then lead free next
in
two steps. Please guide me.

Sincerely

K.Balasubramanian
Sr.Engineer, Hardware.

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