TECHNET Archives

June 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 4 Jun 2004 13:31:38 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
The quick answers: Only if absolutely necessary. And Technet archives.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Chafin, Ken G.
> Sent: Friday, June 04, 2004 1:21 PM
> To: [log in to unmask]
> Subject: [TN] Lead Free Solder and IPC Standards
>
> Does IPC plan to amend standards governing acceptance
> criteria of soldered connections as a consequence of a
> transition to the use of lead free solder.
> If so, where can one locate specific information on this subject.
>
> (I suspect some version of this question has been asked and
> answered many times--just point me in the right direction.)
>
> Thanks

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2