Information I've read indicates there is a good possibility of the leaded
solder on the components diffusing into the lead free solder, creating a new
alloy which may behave differently than intended.  This may be something
else to consider in addition to temperature.

Shean R. Dalton
Austin American Technologies

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Balasubramanian
Krishnan
Sent: Friday, June 04, 2004 8:13 AM
To: [log in to unmask]
Subject: [TN] Mixed assembly of ROHS & Non ROHS components


Dear Experts,

      Is it possible to use some normal components (with lead) along with
lead free components in the same PCBA. Since the tempertaure requirement of
lead free components is higher will it affect the normal components? Or is
it possible to assemble normal components first and then lead free next in
two steps. Please guide me.

Sincerely

K.Balasubramanian
Sr.Engineer, Hardware.

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