Hi Steve,
we use up to 2,500 and will see even larger soon. We had some to learn, that's for sure. Lucent, Mota, Xilinx, Honeywell etc were helping us with BGA cracks, IMC, coplanarity problem, solder criteria, pad cleanliness, ENIG quality, black pads and a lot more. Worst problem was one single or so intermittent contact on some of the many hundred balls. I would start with checking the coplanarity with both parts, board and BGA. After that I would check wetting characteristics on all pads of a whole board, to see if there is a spread. And visit the board maker too see what chemistry control they have in the daily work (6 Sigma, hate the word). Others in this forum know better than I, and will certainly drown you with good advice...which you need.
If you get into IMC, black pad or other trouble, I can send you some stuff, or contact Jack Crawford, Georg Wenger, Kathy Kuhlow..there are some more near you, they have my final reporting about lots of Xilinx trouble a couple of years ago. They helped us, so I feel we may give something back to others.
Hopefully, you may escape from all kind of disaster, you are a lucky guy as always!
Cheers, bon appetite!
Ingemar Hernefjord
Ericsson Microwave Systems
PS. 'Xilinx' problems can be misleading, we have absolutely zero problems today.
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Gregory
Sent: den 3 juni 2004 20:09
To: [log in to unmask]
Subject: [TN] Xilinx Virtex-II BGA's...
Afternoon All!
We've quoted some work here to build some boards with a 3-per assembly,
Xilinx Virtex-II, 1152-ball BGA on them.
Have any of you ever placed these BGA's before? Is there anything special
about them to look out for when assembling them?
This will be my first time messing around with a BGA with that kind of ball
count,
and at over $6,000 each, I sure don't want to screw things up...
TIA!!
-Steve Gregory-
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