We did some rework on a board with those components. We found it necessary
to maintain a fairly low delta between the component and the bottom side of
the board. Even a little crown produces solder bridges in the center balls.
The package stayed flat as a stone (unlike that Flex 484 package). It should
not be a problem in a reflow oven.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Thursday, June 03, 2004 2:09 PM
> To: [log in to unmask]
> Subject: [TN] Xilinx Virtex-II BGA's...
>
> Afternoon All!
>
> We've quoted some work here to build some boards with a 3-per
> assembly, Xilinx Virtex-II, 1152-ball BGA on them.
>
> Have any of you ever placed these BGA's before? Is there
> anything special about them to look out for when assembling them?
>
> This will be my first time messing around with a BGA with
> that kind of ball count, and at over $6,000 each, I sure
> don't want to screw things up...
>
> TIA!!
>
> -Steve Gregory-
>

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