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June 2004

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 25 Jun 2004 13:34:24 -0700
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Steve: No, it will decompose at those times and temperatures. Can you use a
lower temp bonding agent? You might be able to get away with 200 F for 30
minutes depending on what flavor ENTEK you're using.
Of course a lot depends on what type of flux, duration and the number of
thermal exposures it will see in assembly.

                                                                Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076

-----Original Message-----
From: Steve Kelly [mailto:[log in to unmask]]
Sent: Friday, June 25, 2004 12:13 PM
To: [log in to unmask]
Subject: [TN] OSP Question


Good afternoon,

I have a question on the thermal characteristics of Entek OSP. We have a
flex circuit which requires OSP as the finish. We intend to do the OSP
operation but then we have to thermally bond a rigid stiffener on the flex.
OSP will see pressure and a temperature of approx. 350 F for 1 hour. Will
the OSP handle this. Thanks for your help. Regards Steve Kelly



PFC Flexible Circuits Limited

Ph: (416) 750-8433

Fax: (416) 750-0016

Cell: (416) 577-8433

E-Mail: [log in to unmask]




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