Tom

 

The best way to deal with this is to fill the vias with a plateable past and then plate a copper cap over the via. There are several PCB suppliers offering this thechnology.

 

Best regardsd

 

Lee



	-----Original Message----- 

	From: TechNet on behalf of Tom Parkinson 

	Sent: Fri 6/25/2004 10:19 AM 

	To: [log in to unmask] 

	Cc: 

	Subject: [TN] VIA in Pad

	

	



	We're a CM.  One of our customers is asking us to build a board assembly

	that will be using BGAs with VIAs in pads.  They are in the design stages at

	this point, and we have some concerns with having a Via in the middle of a

	BGA pad.  Anyone have suggestions and/or experience with this??

	

	

	

	Thanks

	

	

	

	

	

	Tom Parkinson - Quality System Manager - CIT

	

	WinTronics, Inc.

	

	Ph: 724-981-5770 Ext. 235

	

	Fax: 724-981-1772

	

	

	

	

	

	

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