On the other hand, you can apply a conductive epoxy to the hole. If
processed properly it will finish out
with a very small convex pad to a perfectly flat pad.
Roger Tingler
Methods Engineer
Colonial Circuits Inc.
V:800-578-9602 ext:102
F:800-578-0856
E-mail:[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Vladimir Igoshev
Sent: Friday, June 25, 2004 2:38 PM
To: [log in to unmask]
Subject: Re: [TN] VIA in Pad
Just to add to what Tom has said, voids are usually not huge (if everything
is fine with the process), so it should be nothings to worry about. In
addition, similar voids are not uncommon thing even in the joints on
microvia-free pads.
Vladimir Igoshev,
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]
-----Original Message-----
From: Daan Terstegge [mailto:[log in to unmask]]
Sent: Friday, June 25, 2004 11:29 AM
To: [log in to unmask]
Subject: Re: [TN] VIA in Pad
Hi Tom,
You will get voids in the solderjoints.
This is not necessarily a bad thing, but some would argue it is outside
the limits of the IPC-A-610. If you read it carefully, you will see that
IPC-A-610 gives a lot of freedom with respect to voiding (it suggests
some inpection criteria, that's all), so you have to ask the question if
everyone involved with the acceptance of the products is a carefull
reader.
Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
>>> [log in to unmask] 06/25/04 05:19pm >>>
We're a CM. One of our customers is asking us to build a board
assembly
that will be using BGAs with VIAs in pads. They are in the design
stages at
this point, and we have some concerns with having a Via in the middle
of a
BGA pad. Anyone have suggestions and/or experience with this??
Thanks
Tom Parkinson - Quality System Manager - CIT
WinTronics, Inc.
Ph: 724-981-5770 Ext. 235
Fax: 724-981-1772
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