We have seen over aggressive micro-etch prior to NI undercut the mask
and affect the adhesion - a microsection across the interface will show
the "step" where the exposed conductors were etched verses the area
protected my mask and rate can be determined.  Some masks are also less
compatible with ENIG than others. 



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Kathy Bergman [mailto:[log in to unmask]] 
Sent: Thursday, June 24, 2004 8:14 PM
To: [log in to unmask]
Subject: [TN] ENIG and flaking mask


Hello Tech Netters,

Has anyone dealt with the following condition:

Bare boards are ENIG, several SMT pads within wide traces. After ENIG,
soldermask is peeling from copper on the traces, at the junction of the
ENIG and mask. We have eliminated any mask failure possibilities. What,
if anything in the ENIG process (or error in the process) would
compromise the soldermask adhesion and lift it from the copper?

Any help will be appreciated.

K Bergman

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------