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June 2004

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Jun 2004 08:57:46 -0700
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Joe,

The use of "No-Clean" for rework is problematic. Unvulcanized flux will go
places where it can not be removed. The best method to deal with this is to
run the boards back through an oven and make sure the entire board reaches
a high enough temperature to vulcanize the remaining flux.

If there is a combination of fluxes on the board you are in serious trouble.
Do all the RMA rework and clean-up prior to "No-Clean" rework.

Hope this helps.

David A. Douthit
Manager
LoCan LLC

Macko, Joe @ IEC wrote:

>Fellow Technets,
>
>We are looking at switching to a "batch" type cleaner from our WESTEK
>in-line cleaner for circuit boards.  We outsource all of our board assembly
>so we do not have to worry about cleaning screens, etc..  Our boards are
>densely populated, double sided with multiple BGAs on both sides. We use
>wire form, RMA cored solder for in-house rework and touch up.  Use NC for
>BGA rework.
>
>Looking for some recommendation / comments on what fellow techs are using to
>successfully clean their boards - make, model, etc....  Their seem to be a
>lot of units out there.  Thanks
>
>joe
>
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