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June 2004

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Subject:
From:
Shean Dalton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Jun 2004 08:00:57 -0500
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text/plain (51 lines)
Hi Karl,

Especially immediately after Peak Temp and during the Cool Down slope.  For
this reason, nitrogen inertion in the cooling zone can be critical to
achieve shiny joints.  I found this critical for reflowing bumps on BGAs and
Wafers.

Shean Dalton
Austin American Technology


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of SUBSCRIBE Technet
Karl Loh
Sent: Thursday, June 24, 2004 6:43 AM
To: [log in to unmask]
Subject: [TN] Oxidation of reflowed solder


Hello,

During reflow, flux de-oxidizes solder.  After reflow, does the solder re-
oxidize?  If so, how long does it take?

Thanks
Karl

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