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June 2004

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 Jun 2004 16:29:19 EDT
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text/plain (27 lines)
Hi Phil,
There is no impact of 105 sec instead of 90 sec above Liqidus. Remember that, 
for the reflow soldering time above Liquidus is a meaningless number. For 
Sn63Pb37 solder, time above Liquidus+20°C when soldering to copper [that does not 
mean soldering to already solder-wetted copper], and Liquidus+35°C when 
soldering to nickel/Alloy42 is the important parameter, and needs to be 5 sec or 
longer for the slowest heating connection.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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