Procedure 6.3 is dated 03/01. It does not appear in my table of contents,
page xii, which is dated March 2000, and ends with procedure 6.2.1.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
> Sent: Monday, June 21, 2004 10:30 AM
> To: [log in to unmask]
> Subject: Re: [TN] Dead Bugs
>
> Guy,
>
> My copy of IPC-7721 dated February, 1998 only goes up to
> procedure 5.3.
> What rev do you have that goes further? thanks
>
> joe
>
> -----Original Message-----
> From: Guy Ramsey [mailto:[log in to unmask]]
> Sent: Friday, June 18, 2004 8:20 AM
> To: [log in to unmask]
> Subject: Re: [TN] Dead Bugs
>
>
> The method is described in IPC-7721 Procedure 6.3, figure 10.
> Skill level required is advanced and level of conformance is
> N/A. There are a lot of
> unknowns: ceramic or plastic component, method of bonding the
> package and the wires. Properly done this should be a very
> reliable modification.
>
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Joseph E
> > Sent: Friday, June 18, 2004 10:27 AM
> > To: [log in to unmask]
> > Subject: [TN] Dead Bugs
> >
> > We've talked before about implementing design changes with
> "dead bug"
> > components, where you turn the part upside down, bond it to
> the board
> > surface, and solder wires to the pins.
> >
> > Of course, this takes more labor, but sometimes it's useful to
> > implement a change for a short time while artwork is being updated.
> >
> > Now we have a customer talking about disallowing this practice for
> > production. Anyone have a good reason why dead bugs should be
> > outlawed? Are there any specs that prohibit this?
> >
> > Joe Kane
> > BAE SYSTEMS Controls
> > Johnson City, NY
>
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