TECHNET Archives

June 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Barr, Bob" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 21 Jun 2004 11:47:27 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (38 lines)
Dave,

ANSI/EIA-481-B talks about orientation in para. 4.14. There is also an
Errata #1 to the spec that expands on component orientation. There may be
other specs, but this is one that I know of.

=========================
Bob Barr
Manufacturing Engineering
Formation, Inc.
=========================

>
> -----Original Message-----
> From: Dave Chapman [log in to unmask]
> Sent: Monday, June 21, 2004 10:19 AM
> To: [log in to unmask]
> Subject: [TN] Component packaging
>
> Is there a IPC, JEDEC or EIA document that references how ICs
> should be
> packaged when on tape and reel? Specifically pin 1 locations
> or package
> angle as we know it in SMT. I've been through ANSI/IPC-SM780
> (March of 1998)
> but not much there.
> Dave Chapman

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2