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June 2004

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Subject:
From:
Cal Driscoll <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 18 Jun 2004 13:10:54 -0400
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Hello all-
Thanks for the valuable input.
In regards to no clean cleaning is a process decision.

We do paste/ paste on double sided boards. For the through hole components
we run them through the wave soldering machine.

We use a selective soldering pallet to do the through hole components.
Our Wave fluxer is a foam style.

When we flux the boards the excess flux gets trapped under the selective
soldering pallet and never burns off . This excess flux, schmootz, gooo,
famunda, spooge is left behind and is pretty thick.

OK why don't we Glue/paste? is the dozens of resistor networks that populate
the board bottom.

I hope this makes sense.

Cal


-----Original Message-----
From: Susan Mansilla [mailto:[log in to unmask]]
Sent: Thursday, June 17, 2004 2:37 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning PCB's With Ultrasonics...


The first item in your process is NO CLEAN.
What testing has someone done to determine the need for this extreme
cleaning
of assemblies using no clean processes?

Susan Mansilla
Robisan Lab

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