The method is described in IPC-7721 Procedure 6.3, figure 10.  Skill level
required is advanced and level of conformance is N/A. There are a lot of
unknowns: ceramic or plastic component, method of bonding the package and
the wires. Properly done this should be a very reliable modification.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Joseph E
> Sent: Friday, June 18, 2004 10:27 AM
> To: [log in to unmask]
> Subject: [TN] Dead Bugs
>
> We've talked before about implementing design changes with
> "dead bug" components, where you turn the part upside down,
> bond it to the board surface, and solder wires to the pins.
>
> Of course, this takes more labor, but sometimes it's useful
> to implement a change for a short time while artwork is being updated.
>
> Now we have a customer talking about disallowing this
> practice for production.  Anyone have a good reason why dead
> bugs should be outlawed?  Are there any specs that prohibit this?
>
> Joe Kane
> BAE SYSTEMS Controls
> Johnson City, NY

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