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June 2004

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Subject:
From:
Andrew Medina <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 Jun 2004 17:26:22 +0800
Content-Type:
text/plain
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Dear Technetters,

Just want to ask if there any spec for the bonding or adhesion
between multibond and prepreg in a multilayer boards.

Thanks,
Andrew J. Medina
Quality Control Section
QM Department
Daeduck Phils.,  Inc.
Tel # : 046-4370747 loc 293
Fax # : 046-437-0749
Mobile # : +639275312569

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