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June 2004

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 16 Jun 2004 22:18:21 -0700
Content-Type:
text/plain
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text/plain (108 lines)
Ken,

Exposure to 288 degrees C for a period of time (T260 = 260 degrees C
exposure).

David A. Douthit
Manager
LoCan LLC

Ken Patel wrote:

>Gerard,
>HASL - I meant eutectic solder (63/37).
>
>What does it mean T288 performance?
>
>Re,
>Ken Patel
>
>-----Original Message-----
>From: Gerard O'Brien [mailto:[log in to unmask]]
>Sent: Wednesday, June 16, 2004 5:05 AM
>To: TechNet E-Mail Forum.; Ken Patel
>Subject: RE: [TN] Lead-free Assy process and fab surface finish
>
>Ken - depending on the OSP coating being used and the flux activation levels
>- you may be forced into N2 atmosphere. For ENIG we have seen no problems.
>For HASL - do you mean a lead free alloy?
>
>
>The Tg of the material is NOT as critical as the T288 performance. A
>laminate with a T288 of 15+ minutes will provide you all the necessary
>performance needed for Pb free assembly. There are many Tg 170 materials out
>there that have excellent T260 results but blow up ever before reaching
>288C.
>
>Regards
>
>
>Gerard O'Brien
>Photocircuits Corporation
>
>-----Original Message-----
>From: Ken Patel [mailto:[log in to unmask]]
>Sent: Tuesday, June 15, 2004 4:07 PM
>To: [log in to unmask]
>Subject: [TN] Lead-free Assy process and fab surface finish
>
>Technetters,
>
>I do have few questions related to fab surface finish in lead-free assembly
>environment.
>
>
>
>(1)Do you see any problem with board surface finishes, particularly OSP,
>HASL, and Nickel-Gold?
>
>
>
>(2) What should be the minimum Tg of Fab material? Is Tg of >170C is good
>enough?
>
>
>
>Re,
>
>Ken Patel
>
>
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