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June 2004

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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 16 Jun 2004 17:12:47 -0700
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Gerard,
HASL - I meant eutectic solder (63/37).

What does it mean T288 performance?

Re,
Ken Patel

-----Original Message-----
From: Gerard O'Brien [mailto:[log in to unmask]]
Sent: Wednesday, June 16, 2004 5:05 AM
To: TechNet E-Mail Forum.; Ken Patel
Subject: RE: [TN] Lead-free Assy process and fab surface finish

Ken - depending on the OSP coating being used and the flux activation levels
- you may be forced into N2 atmosphere. For ENIG we have seen no problems.
For HASL - do you mean a lead free alloy?


The Tg of the material is NOT as critical as the T288 performance. A
laminate with a T288 of 15+ minutes will provide you all the necessary
performance needed for Pb free assembly. There are many Tg 170 materials out
there that have excellent T260 results but blow up ever before reaching
288C.

Regards


Gerard O'Brien
Photocircuits Corporation

-----Original Message-----
From: Ken Patel [mailto:[log in to unmask]]
Sent: Tuesday, June 15, 2004 4:07 PM
To: [log in to unmask]
Subject: [TN] Lead-free Assy process and fab surface finish

Technetters,

I do have few questions related to fab surface finish in lead-free assembly
environment.



(1)Do you see any problem with board surface finishes, particularly OSP,
HASL, and Nickel-Gold?



(2) What should be the minimum Tg of Fab material? Is Tg of >170C is good
enough?



Re,

Ken Patel


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