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June 2004

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Subject:
Impact of Mixed, Lead and Lead-free, components on assembly proce sses
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 1 Jun 2004 16:05:00 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (62 lines) 
Dear Technetters,

I have been informed by my engineering that many part manufacturers started
providing list of EOL components (end of life) as they are switching to
lead-free parts.



As there will be a transition period from current PbSn process to lead-free
process, I see the following phases.

(a)    Lead components processed using eutectic solder (your current
process).

(b)    Mixed components (lead and lead-free) running using eutectic
soldering process

(c)    Mixed components (lead and lead-free) running using LEAD-FREE
assembly process at CM.

(d)    Lead-free components running on LEAD-FREE assembly processes.



Based on above, I have the following primary concerns.

(1)    Do you see any problem in processing mixed, lead and lead-free,
components on a board?

(2)    Will there be change in thermal profile when running lead-free
components on PbSn process?

(3)    If higher temperature is required then what is going to happen to
lead processes component? They may not withstand the high temp.

(4)    Should we ask for certificate from the lead component suppliers
stating their lead parts can with stand higher temp?

(5)    Are you preparing we imagine for lead-free processes in near future
and when?



Any help will be highly appreciated.



Re,

Ken Patel


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