Hello, LF'ers:

Regarding the discussions of "tin pest" that took place on this forum
recently, I find myself left with a question:

Is the tin pest phenomenon cause for concern for Sn99.3/Cu0.7 solder?  As I
recall from the discussion, certain alloying elements (such as silver,
bismuth, and --of course-- lead) all but eliminate "tin pest" at any
reasonable temperature, while other alloying elements (such as copper),
merely reduce the temperature at which tin's crystalline structure changes
from beta to alpha.  So how cold can Sn99.3/Cu0.7 get before it starts to
succumb to "tin pest"?


James M. Chessman, Test Engineer
Reptron Manufacturing Services, Gaylord
1746 O'Rourke Blvd
Gaylord, MI 49735
Direct Phone: (989) 705-3149
<[log in to unmask]>

Horse sense is the thing a horse has which keeps it from betting on people.

    -- W. C. Fields

God Bless America!

Please note: All *@kbyte.net e-mail addresses are have been changed to
*@reptron.com.

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------