I just use a srandard range of cleaning solvents when I do testing. On many
occasions I don't clean but the dye still find its way in.
A product I often us is safewash for cleaning and preping samples, its a semi
aqueous cleaner.
On 6/28/2004, "Victor G. Hernandez" <[log in to unmask]> wrote:
>Bob,
>
> Is there a recommended LF FLUX Remover for BGA. A glass like
>residue surround the BGA periphery on the PCB side which form a tight
>seals which hinders the use of a DYE PENETRANT Process for BGA Integrity
>Test. Any comments on this issue.
>
>Victor.
>
>-----Original Message-----
>From: Leadfree [mailto:[log in to unmask]] On Behalf Of Bob willis
>Sent: Thursday, June 24, 2004 1:02 AM
>To: [log in to unmask]
>Subject: Re: [LF] LF BGAS on Tin/Lead PCBs process
>
>
>I am contributing a small section of work on this subject for the NPL
>Team, the complete project plan can be seen at www.npl.co.uk/ei
>
>
>Bob Willis
>2 Fourth Ave, Chelmsford,
>Essex, CM1 4HA, England
>Tel: 01245 351502
>Fax: 01245 496123
>Mobile: 07860 775858
>Email: [log in to unmask]
>Web: www.leadfreesoldering.com
>Web: www.bobwillis.co.uk
>
>
>-----Original Message-----
>From: Leadfree [mailto:[log in to unmask]] On Behalf Of Reuven ROKAH
>Sent: 20 June 2004 06:40
>To: [log in to unmask]
>Subject: Re: [LF] LF BGAS on Tin/Lead PCBs process
>
>Thanks Roger, and Bob
>
>This issue of soldering Lead Free BGAs on Tin lead PCBs and process is
>an actual issue that is relevant now and will be more relevant as we are
>moving to the July 2006 . More and more suppliers are moving to Lead
>Free BGAs and closing the Tin Lead BGAs production.
>
>I hope that some new Formal research's will be available regarding
>reliability issues of such solder joints and even IPC or Soldertec may
>clarify this issue.
>
>Such as :Comparison table with strong and weak points of LF vs Tin
>Lead:
>
>1. Structure of the solder joint (metallurgical aspect).
>2. Strength , elasticities of the solder joins.
>3. Resistance to vibration, cold, heat,
>4. Coplanarity
>5. Conductivity
>
>Etc.
>
>Best Regards
>
>Reuven ROKAH
>
>
>
>
> Roger Bilham
> <[log in to unmask] To: "(Leadfree
>Electronics Assembly Forum)" <[log in to unmask]>,
> n.co.uk> [log in to unmask]
> cc:
> 18/06/2004 09:48 Subject: Re: [LF] LF BGAS
>on Tin/Lead PCBs process
> Please respond
> to Roger Bilham
>
>
>
>
>
>Reuven,
>
>There are many references to this situation - some claiming less
>reliability than completely lead-free and some more. One, claiming less
>reliability, which I came across yesterday is: Nurmi et al., "The
>influence of multiple reflow cycles on solder joint voids for lead-free
>BGAs", Soldering and Surface Mount Technology, (15) no. 1, 2003, p31-38.
>
>Regards,
>Roger Bilham
>[log in to unmask]
>http://www.bilham.demon.co.uk
>
>In message <[log in to unmask]>, Reuven
>ROKAH <[log in to unmask]> writes
>>Hi All,
>>
>>Any progress with the ability to solder Lead Free BGAs components on
>>Tin/Lead PCBs process ???
>>
>>Any reliability reports, cross sections, pull tests etc.???
>>
>>Best Regards
>>
>>Reuven ROKAH
>>
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>>additional information, or contact Keach Sasamori at [log in to unmask] or
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>>
>
>--
>Roger Bilham
>
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>-------------------------------------------------------------------------------Leadfee
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for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
>-------------------------------------------------------------------------------
>
Bob Willis
2 Fourth Ave, Chelmsford
Essex, CM1 4HA England
Tel +44 01245 351502
Fax +44 01245 496123
Web www.leadfreesoldering.com
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