Paul
I agree with your comments and would like to add a profound piece of
legislative interpretation.
We already know RoHS exempts high melting point, high temperature lead
typically used within components as die attach. In addition, point 7 of the
RoHS Annex exempts "lead in the solders for servers, storage array systems,
network infrastructure.". Regardless of whether or not the device is ASIC,
if its package were a BGA (or BGA derivative) used in one of the above
applications, one could argue that the solder balls are exempt. There is no
reason to assume this solder exemption has to be externally introduced.
Moreover, in December 2003, Brussels attempted to clarify the term
'homogeneous' as "a unit that cannot be mechanically disjointed into single
materials". Obviously solder can be mechanically disjointed by simply
applying heat, thereby placing it outside of the homogeneous component.
Kind regards
Paul
Paul Chinery
Managing Director
Dionics PLC
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-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of to Paul Taylor
Sent: 28 June 2004 09:29
To: [log in to unmask]
Subject: Re: [LF] Leadfree exceptions for Rohs
Dave
Do you know how much lead it actually contains? Are you talking about the
lead-frame or components (i.e soldered with high melting point solder)
contained within the package?
I agree with Ma/NY Dave, that you'll never get an exemption in advance. it
would be absolute bedlam with every manufacturer of products applying so
that they can use up some old stock!!
If it is contained within the package, you will be ok as the whole point
about the RoHS is to avoid toxic compounds leaching into the environment,
and a sealed IC package would be ok.
As a talking point, this whole subject of components in the production
pipeline I believe is going to prove very difficult to manage, police and
document. The component manufactures haven't helped a great deal as even
now, there are a great many components that are not available with a lead
free finish. Manufactures who have short turn round designs (i.e cell
phones) will have no trouble in cleaning their pipeline between 2005-2006,
however there is another huge slice of the manufactures whose product life
cycle is 5 years instead of 18months!! and who have speciality components
like ASIC included!. These companies I doubt whether they can afford to
re-engineer every product and discard all the old stock (which by the way
would be worse as if it was used it could be reclaimed under the WEE
directive later, however if they dump them I expect it will be to the
landfills)
Also, if its the leadframe only, could you rely on maths for your
exemption. One IC, say with 100 terminations (legs) would be ok is your
total leg count (IC and passives) was over 1000? This would be less than
0.1%
regards
paul
Paul R Taylor
Senior Engineer, Product Supply Group
Pitney Bowes Ltd
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