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Date: | Wed, 23 Jun 2004 17:53:23 -0700 |
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Rick,
Good summary of a poorly discussed area.
For the long thin resistors to have better thermal dissipation, doesn't
this imply that the FR4 has better heat conduction (and heat capacity)
than the Cu terminals? I had seen some modeling studies that showed
significant thermal transfer at the terminals (Clouser, IPC EXPO'03?),
to a point where trim cuts close to the terminals do not create hot
spots.
Am I missing something?
Kim Fjeldsted
503.671.5218 Office
503.819.2176 Cell
-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of Richard
Ulrich
Sent: Tuesday, June 22, 2004 1:33 PM
To: [log in to unmask]
Subject: [EM] CircuiTree Column
As usual, I'd like to show the draft of my upcoming column to you EP
experts, so please let me know what needs to be added or changed. I've
got a couple of weeks before it's due.
Also, does anyone have a nice picture having to do with the thermal
effects of embedded resistors that I could submit along with this
article?
- Rick
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